VERIFICATION & VALIDATION
Solver Verification
& Validation
This page describes what Verixos has validated today, what is only partially validated, and what is still planned. The current evidence base is strongest for lumped-parameter thermal solving itself; it is materially weaker for direct commercial-tool parity, hardware correlation, and thermal-structural truth prediction, and we do not claim those are complete yet.
13implemented benchmark artifacts
2structural handoff formats
1documented heritage reproduction chain
CURRENT POSTUREWhat Exists Today
The current platform has real solver verification, a meaningful SAE parity argument, one documented heritage reproduction chain, and working structural temperature handoff infrastructure. It does not yet have a published open benchmark pack against Thermal Desktop or ESATAN, and it does not yet have a completed public commercial FEA pilot.
Analytical VerificationImplemented today
The solver core is covered by closed-form conduction, radiation, enclosure, convection, heat-pipe, and optics checks that run directly from the repo.
SAE 961452 ParityImplemented today
Verixos matches or exceeds the SINDA/FLUINT analytical benchmark tolerances reported in SAE 961452 across the implemented parity points.
PharmaSat Heritage ChainImplemented today
Verixos reproduces a documented PharmaSat / SatTherm case. This is a heritage reproduction chain, not a direct re-run of raw NASA telemetry in Verixos.
Structural Temperature HandoffImplemented today
NASTRAN and Abaqus temperature artifacts, provenance-aware node mapping, and coupling manifests are available when source structural labels exist.
Published Public-Reference ParityImplemented for named cases
The repo now includes a published Abaqus NAFEMS T3 transient-conduction parity pack and a NASA/NASTRAN washer steady-state parity pack with reproducible in-repo artifacts.
TVAC / Flight Correlation ToolingAvailable in product
The platform has test-dataset import, correlation, posterior uncertainty, and flight-telemetry workflows, but no public hardware-correlation benchmark pack is published yet.
Commercial Tool ParityNot yet published
There is no public Verixos-vs-Thermal Desktop or Verixos-vs-ESATAN benchmark pack in the repo today, and no completed commercial FEA pilot artifact set is published.
IMPLEMENTED CHECKSVerification Artifacts In Repo
These checks can be run directly from the repository today. Some are exact analytical comparisons, some are heritage reproductions, and some are interim product benchmarks. They should not all be interpreted as the same level of external credibility.
CHECK 1.1Incropera Ch. 5
Conduction Transient
Single-node lumped capacitance cooling
0.026%RK4 error
CHECK 1.2Cengel Ch. 3
Two-Node Steady State
Coupled conduction to boundary
0.030 Kabsolute error
CHECK 1.3NASA SP-8105
Radiation Equilibrium
Solar flux / deep-space balance (3 cases)
< 1 Kall cases
CHECK 1.4Cengel Ch. 12
Radiation Cool-Down
T⁴ nonlinearity — pure radiative transient
0.0014%RK4 error
CHECK 1.5Incropera Ch. 13
Parallel Plates Radk
Grey-body radiation conductor
0.0000%exact match
CHECK 1.6Howell catalog
Enclosure Closure
View factor sum rule Σ Fᵢⱼ = 1
0.002%row-sum error
CHECK 1.7Incropera radiation shields
Radiation Shield Enclosure
Three-surface diffuse-gray shield equilibrium
< 0.05 Kshield temp error
CHECK B9Repo benchmark
Heat Pipe Conductor Curve
Piecewise-effective conductance benchmark at cold, nominal, and hot points
0.0039%worst ΔT error
CHECK B10Repo benchmark
Monte Carlo View Factors
Parallel disks, perpendicular rectangles, and concentric spheres
0.31%worst current error @ 1e5 rays
CHECK 2BCoating benchmark
Two-Band Optics
Material-driven α_solar / ε_IR equilibrium with coating assumptions
< 1 Kequilibrium error
PHASE 2SAE 961452 Parity
SAE Technical Paper 961452 (Keller & Vogel, 1996) is the foundational V&V reference for SINDA/FLUINT — the NASA/DoD standard spacecraft thermal analyzer. SINDA/FLUINT achieved < 0.5% agreement on all cases.
This is legitimate analytical parity evidence for the lumped thermal core. It is not the same thing as published parity against Thermal Desktop, ESATAN-TMS, NASTRAN thermal, or Abaqus thermoelastic cases.
CaseDescriptionSINDAVerixosStatus
CASESAE-1Conduction transient (t = τ)SINDA< 0.5%VERIXOS0.026%✓ Exceeds
CASESAE-1Conduction transient (t = 5τ)SINDA< 0.5%VERIXOS0.0004%✓ Exceeds
CASESAE-2Two-node steady-state (T₁)SINDA< 0.5%VERIXOS0.030 K abs✓ Exceeds
CASESAE-2Two-node steady-state (T₂)SINDA< 0.5%VERIXOS0.024 K abs✓ Exceeds
CASESAE-3Radiation transient T⁴ (500 s)SINDA< 0.5%VERIXOS0.0014%✓ Exceeds
CASESAE-3Radiation transient T⁴ (1000 s)SINDA< 0.5%VERIXOS0.0011%✓ Exceeds
CASESAE-3Radiation transient T⁴ (2000 s)SINDA< 0.5%VERIXOS0.0006%✓ Exceeds
CASESAE-4Radiation conductor (parallel plates)SINDA< 0.5%VERIXOS0.0000%✓ Exceeds
CASESAE-5Enclosure closure (VF sum)SINDA< 0.5%VERIXOS0.002%✓ Exceeds
PHASE 3PharmaSat Mission Reproduction
PharmaSat was a NASA 1U CubeSat deployed from the ISS in May 2009 (~400 km, 51.6° inclination). Its thermal behavior was modeled with SatTherm and independently validated against Thermal Desktop and on-orbit telemetry. We reproduce SatTherm’s published orbit-averaged steady-state results using a 3-node Verixos model.
StructureVerixos18.1 °C
SatTherm17.5 °C
± 0.6 K PCB / ElectronicsVerixos22.1 °C
SatTherm27.5 °C
± 5.4 K BatteryVerixos18.1 °C
SatTherm20.0 °C
± 1.9 K This is a documented flight-heritage reproduction chain, not a direct ingest of public raw NASA telemetry into Verixos. SatTherm itself agreed with the flight-validated Thermal Desktop model to within 4 °C, and Verixos falls within 5.4 K of SatTherm’s published midrange values for this simplified model tier.
CLAIM BOUNDARIESWhat We Can And Cannot Claim Today
This is the most important section on the page. It is the line between credible engineering evidence and marketing overreach.
We Can Claim
Strong analytical verification for the lumped thermal core across the implemented benchmark set.
SAE 961452 analytical parity evidence against the SINDA/FLUINT benchmark family.
A documented PharmaSat flight-heritage reproduction chain with explicit assumptions and limitations.
Narrow published-tool parity for named public cases: Abaqus NAFEMS T3 and the NASA/NASTRAN washer conduction problem.
Exact NASTRAN / Abaqus temperature handoff artifacts when imported structural provenance exists.
We Do Not Claim Yet
Broad Thermal Desktop parity across representative spacecraft models.
Direct ESATAN-TMS parity.
Validated thermal-structural deformation or stress truth without external FEA comparison and hardware correlation.
General flight-correlation credibility across multiple public missions.
A completed commercial NASTRAN or Abaqus customer pilot published as validation evidence.
TRANSPARENCYKnown Limitations
We believe transparency builds trust. Here is what the Verixos solver does not currently validate to a production-credible standard.
MLI (multi-layer insulation)HighHigh-fidelity MLI behavior is not yet validated; most surfaces are still modeled as bare or effective grey bodies.
Fluid loops / pumped coolantHighThe validated domain is lumped conduction / radiation / convection, not CFD or pumped-fluid thermal control.
Heat pipe two-phase limitsMediumHeat pipes are benchmarked as effective conductance elements, not fully validated two-phase devices with startup/orientation limits.
Contact conductanceMediumImportant interface values remain engineering assumptions until bracketed by test or hardware correlation.
Non-grey / spectral radiationLow–MedTwo-band optics are supported, but full spectral temperature-dependent radiation has not been validated.
Thermal-structural truth predictionMedium–HighTemperature handoff is implemented; structural displacement/stress truth still requires external FEA and benchmark correlation.
Broad Thermal Desktop / ESATAN parityMediumPlanned but not yet published as an open benchmark pack.
Broad public flight correlationMediumOne documented heritage reproduction exists, but multiple direct telemetry correlation cases are not yet published.
NEXT EVIDENCEExternal Validation Targets
These are the highest-value next steps for proving credibility beyond internal verification: public commercial-tool parity, hardware correlation, and flight or heritage correlation with enough context to be defensible.
Thermal Desktop Public BenchmarksPlannedSimple spacecraft box and deployed-array parity cases from published C&R material or equivalent public cases.
Abaqus Thermoelastic BenchmarksUnderwayAbaqus NAFEMS T3 is now reproduced in-repo; thermoelastic thermal-expansion artifact and analytical reference are scaffolded next.
NASA / NASTRAN Thermal Sample ProblemsUnderwayThe washer conduction problem from the NASA NASTRAN demonstration manual is now reproduced in-repo; structural-deck acceptance is still a later step.
TVAC Correlation ArticlePlannedInstrumented hardware article with mapped channels, residuals, posterior uncertainty, and report traceability.
Public Flight Correlation CasePlannedFASTSAT-HSV01 or similar public mission with enough orbit and temperature context to support a defensible comparison.
OPEN SOURCERun the Tests Yourself
Most current verification artifacts are standalone TypeScript files. No running server or database is required for the core solver checks.
# Run all V&V tests
$ pnpm test src/lib/solver/__tests__/validation/
# Selected implemented checks
$ node --import tsx src/lib/solver/__tests__/validation/sae-961452.test.ts
$ node --import tsx src/lib/solver/__tests__/validation/pharmasat.test.ts
$ node --import tsx src/lib/solver/__tests__/validation/radiation-shield-enclosure.test.ts
$ node --import tsx src/__tests__/benchmarks/benchmark-09.test.ts
$ node --import tsx src/__tests__/benchmarks/benchmark-10.test.ts
REFERENCESCitations
- [1]NASA-STD-7009, Standard for Models and Simulations, credibility assessment framework.
- [2]ECSS-E-ST-31C, Thermal Control General Requirements.
- [3]Incropera, F.P. et al., Fundamentals of Heat and Mass Transfer, 7th Ed., Wiley, 2011.
- [4]Cengel, Y.A., Ghajar, A.J., Heat and Mass Transfer, 5th Ed., McGraw-Hill, 2015.
- [5]Howell, J.R. et al., Thermal Radiation Heat Transfer, 7th Ed., CRC Press, 2021.
- [6]Gilmore, D.G. (Ed.), Spacecraft Thermal Control Handbook, Vol. 1, 2nd Ed., AIAA, 2002.
- [7]NASA SP-8105, Spacecraft Thermal Control, May 1973.
- [8]ECSS-E-HB-31-03A, Thermal Analysis Handbook, November 2016.
- [9]Keller, J. & Vogel, M., "Validation of the SINDA/FLUINT Thermal Analyzer Code Using Several Analytical Solutions," SAE 961452, 1996.
- [10]Allison, J.D., "A Thermal Analysis and Design Tool for Small Spacecraft," SJSU Master's Thesis, 2009.
- [11]Allison, J.D. et al., "SatTherm," SSC09-VII-6, 23rd AIAA/USU Small Satellites Conference, 2009.
- [12]Dassault Systèmes Abaqus verification and benchmark documentation (public pages).
- [13]NASA thermal analyzer sample-problem library and thermal sample-problem reports available via NTRS.
- [14]NASA FASTSAT-HSV01 thermal model correlation paper (public NTRS record).
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